Las Vegas, January 8, 2025 — At CES 2025, Morse Micro unveiled the MM8108, its next-generation Wi-Fi HaLow System-on-Chip (SoC), setting new standards in performance, power efficiency, and range for IoT connectivity. Designed on the IEEE 802.11ah standard, the MM8108 is the smallest, fastest, lowest power, and farthest-reaching Wi-Fi chip on the market.
Game-Changing Performance for IoT
The MM8108 delivers data rates up to 43.33 Mbps using world-first sub-GHz 256-QAM modulation across an 8 MHz bandwidth. With a high-efficiency integrated 26dBm power amplifier, low-noise amplifier, and host offloading, the chip is tailor-made for power-sensitive and long-range IoT applications — ranging from smart agriculture to industrial automation and smart cities.
Key Features:
- 256-QAM (MCS9) modulation: Improves spectrum efficiency and minimizes interference
- Integrated PA & LNA: Eliminates the need for SAW filters and simplifies certification
- Ultra-low power: Supports extended battery life and solar-powered applications
- Security first: WPA3 with SAE and GCMP encryption
- Compact 5×5 mm BGA package: Reduces PCB size and cost
- Flexible host interfaces: USB, SDIO, and SPI for seamless integration
Plug-and-Play USB Dongle and Evaluation Kit
Morse Micro also introduced the MM8108-RD09 USB dongle, a reference design for easy Wi-Fi HaLow enablement on Wi-Fi 4/5/6/6E/7 infrastructure. Fully compliant with IEEE 802.11ah, the dongle simplifies upgrades for existing devices.
To support developers, the MM8108-EKH19 evaluation kit — which bundles the dongle with a Raspberry Pi 4B, power supply, and antenna — is available for rapid testing and prototyping.
“The MM8108-EKH19 is more than a platform — it’s a catalyst for the next wave of IoT innovation,” said Michael De Nil, CEO of Morse Micro.
Availability
The MM8108 SoC, MM8108-RD09 USB dongle, and MM8108-EKH19 evaluation kit are now available for sampling. Visit www.morsemicro.com to learn more or request samples.